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Call for Papers

VISAPP is sponsored by INSTICC – Institute for Systems and Technologies of Information, Control and Communication

SCOPE

The International Conference on Computer Vision Theory and Applications aims at becoming a major point of contact between researchers, engineers and practitioners on the area of computer vision application systems. Five simultaneous tracks will be held, covering all different aspects related to computer vision: Image Formation and Preprocessing; Image and Video Analysis and Understanding; Motion, Tracking and Stereo Vision; and Applications and Services.
We welcome papers describing original work in any of the areas listed below. Papers describing advanced prototypes, systems, tools and techniques as well as general survey papers indicating future directions are also encouraged. Paper acceptance will be based on quality, relevance to the conference themes and originality. The conference program will include both oral and poster presentations.
Special sessions, dedicated to case-studies and commercial presentations, as well as technical tutorials, dedicated to technical/scientific topics, are also envisaged. Companies interested in presenting their products/methodologies or researchers interested in lecturing a tutorial are invited to contact the conference secretariat.

CONFERENCE AREAS

The last decade has seen a revolution in the theory and application of Artificial Intelligence and Machine Learning in Computer Vision. In this conference edition, we look at advanced in Computer Vision based on Machine Learning methods. Each of these topic areas is expanded below but the sub-topics list is not exhaustive. Papers may address one or more of the listed sub-topics, although authors should not feel limited by them. Unlisted but related sub-topics are also acceptable, provided they fit in one of the following main topic areas:

1. IMAGE FORMATION AND PREPROCESSING
2. IMAGE AND VIDEO ANALYSIS
3. IMAGE AND VIDEO UNDERSTANDING
4. APPLICATIONS AND SERVICES
5. MOTION, TRACKING AND STEREO VISION


AREA 1: IMAGE FORMATION AND PREPROCESSING


  • Image Formation, Acquisition Devices and Sensors
  • Device Calibration, Characterization and Modeling
  • Image Enhancement and Restoration
  • Image and Video Coding and Compression
  • Multimodal and Multi-Sensor Models of Image Formation
  • Image Generation Pipeline: Algorithms and Techniques

AREA 2: IMAGE AND VIDEO ANALYSIS


  • Image Registration
  • Segmentation and Grouping
  • Early and Biologically-Inspired Vision
  • Color and Texture Analyses
  • Shape Representation and Matching
  • Features Extraction
  • Visual Attention and Image Saliency

AREA 3: IMAGE AND VIDEO UNDERSTANDING


  • Cognitive Models for Interpretation, Integration and Control
  • Machine Learning Technologies for Vision
  • Face and Expression Recognition
  • Content-Based Indexing, Search, and Retrieval
  • Object and Face Recognition
  • Object Detection and Localization
  • Categorization and Scene Understanding
  • Event and Human Activity Recognition
  • Computational Photography
  • Near Duplicate Image Retrieval

AREA 4: APPLICATIONS AND SERVICES


  • Entertainment Imaging Applications
  • Camera Networks and Vision
  • Document Imaging in Business
  • Medical Image Applications
  • Pervasive Smart Cameras
  • Human and Computer Interaction
  • Digital Photography
  • Media Watermarking and Security
  • Multimedia Forensics
  • Mobile Imaging
  • Imaging for Cultural Heritage (Modeling/Simulation, Virtual Restoration)

AREA 5: MOTION, TRACKING AND STEREO VISION


  • Image-Based Modeling and 3D Reconstruction
  • Stereo Vision and Structure from Motion
  • Active and Robot Vision
  • Optical Flow and Motion Analyses
  • Tracking and Visual Navigation
  • Video Surveillance and Event Detection
  • Vision for Robotics
  • Video Stabilization

KEYNOTE SPEAKERS

VISAPP 2016 will have several invited keynote speakers, who are internationally recognized experts in their areas. Their names are not yet confirmed.

PAPER SUBMISSION

Authors should submit a paper in English, carefully checked for correct grammar and spelling, addressing one or several of the conference areas or topics. Each paper should clearly indicate the nature of its technical/scientific contribution, and the problems, domains or environments to which it is applicable. To facilitate the double-blind paper evaluation method, authors are kindly requested to produce and provide the paper WITHOUT any reference to any of the authors, including the authors’ personal details, the acknowledgments section of the paper and any other reference that may disclose the authors’ identity.

Only original papers should be submitted. Authors are advised to read INSTICC's ethical norms regarding plagiarism and self-plagiarism thoroughly before submitting and must make sure that their submissions do not substantially overlap work which has been published elsewhere or simultaneously submitted to a journal or another conference with proceedings. Papers that contain any form of plagiarism will be rejected without reviews.

Authors can submit their work in the form of a Regular Paper, representing completed and validated research, or as a Position Paper, portraying a short report of work in progress or an arguable opinion about an issue discussing ideas, facts, situations, methods, procedures or results of scientific research focused on one of the conference topic areas. All papers must be submitted through the online submission platform PRIMORIS and should follow the instructions and templates that can be found under Guidelines and Templates. After the paper submission has been successfully completed, authors will receive an automatic confirmation e-mail.

PUBLICATIONS

All accepted papers will be published in the conference proceedings, under an ISBN reference, on paper and on digital support.
SCITEPRESS is a member of CrossRef (http://www.crossref.org/) and every paper on our digital library is given a DOI (Digital Object Identifier).
All papers presented at the conference venue will be available at the SCITEPRESS Digital Library.
Authors of selected best papers will be invited to submit extended revised versions to a special edition of Journal of Virtual Reality and Broadcasting (JVRB).
It is planned to publish a short list of revised and extended versions of presented papers with Springer in a CCIS Series book .
The proceedings will be submitted for indexation by .

IMPORTANT DATES

Conference Date: 27 - 29 February, 2016

Paper Submission: September 30, 2015 (expired)
Authors Notification:
November 12, 2015 (expired)
Camera Ready and Registration:
November 27, 2015 (expired)

Paper Submission: November 5, 2015 (expired)
Authors Notification:
December 4, 2015 (expired)
Camera Ready and Registration:
December 18, 2015 (expired)

Workshops
Workshop Proposal: October 26, 2015 (expired)

Doctoral Consortium
Paper Submission: January 3, 2016 (expired)
Authors Notification: January 14, 2016 (expired)
Camera Ready and Registration: January 18, 2016 (expired)

Special Sessions
Special Session Proposal: November 11, 2015 (expired)
Paper Submission: December 4, 2015 (expired)
Authors Notification: December 16, 2015 (expired)
Camera Ready and Registration: December 30, 2015 (expired)

Tutorials
Tutorial Proposal: December 30, 2015 (expired)

Demos
Demo Proposal: December 30, 2015 (expired)

Panels
Panel Proposal: December 30, 2015 (expired)

SECRETARIAT

VISAPP Secretariat
Address: Av. D. Manuel I, 27A, 2º esq.
             2910-595 Setúbal - Portugal
Tel.: +351 265 520 184
Fax: +351 265 520 186
e-mail: visapp.secretariat@insticc.org
Web: http://www.visapp.visigrapp.org/

VENUE

Our event will take place at the Barceló Aran Mantegna Hotel, strategically located in the city of Rome due to the proximity with the city center and the International Airports Fiumicino and Ciampino.

VISIGRAPP CONFERENCE CHAIR

Jose BrazEscola Superior de Tecnologia de Setúbal, Portugal

PROGRAM CO-CHAIRS

Sebastiano BattiatoUniversity of Catania, Italy
Francisco ImaiApple Inc., United States

PROGRAM COMMITTEE MEMBERS

Amr Abdel-Dayem, Laurentian University, Canada
Vicente Alarcon-Aquino, Universidad de las Americas Puebla, Mexico
Mokhled Al-Tarawneh, Mu'tah University, Jordan
Matthew Antone, Massachusetts Institute of Technology, United States
Pantelis Asvestas, University of West Attica, Greece
Hichem Bannour, , United States
Giuseppe Baruffa, University of Perugia, Italy
Ardhendu Behera, Edge Hill University, United Kingdom
Saeid Belkasim, Georgia State University, United States
Fabio Bellavia, Università degli Studi di Firenze, Italy
Olga Bellon, IMAGO Research Group - Universidade Federal do Paraná, Brazil
Neil Bergmann, University of Queensland, Australia
Du Bo, Wuhan University, China
Adrian Bors, University of York, United Kingdom
Marius Brezovan, University of Craiova, Romania
Valentin Brimkov, State University of New York, United States
Alfred Bruckstein, Technion, Israel
Arcangelo Bruna, STMicroelectronics, Italy
Xianbin Cao, Beihang University, China
Alice Caplier, GIPSA-lab, France
Franco Alberto Cardillo, Consiglio Nazionale delle Ricerche, Italy
M. Celebi, University of Central Arkansas, United States
Chee Seng Chan, University of Malaya, Malaysia
Satish Chand, Netaji Subhas Institute of Technology and Jawaharlal Nehru University Delhi, India
Chin-Chen Chang, Feng Chia University, Taiwan, Republic of China
Samuel Cheng, University of Oklahoma, United States
Laurent Cohen, Universite Paris Dauphine, France
Sara Colantonio, ISTI-CNR, Italy
David Connah, , United Kingdom
Donatello Conte, Université de Tours, France
Dima Damen, University of Bristol, United Kingdom
Roy Davies, Royal Holloway, University of London, United Kingdom
Kenneth Dawson-Howe, Trinity College Dublin, Ireland
Guido de Croon, Delft University of Technology, Netherlands
Anselmo Cardoso de Paiva, Universidade Federal do Maranhao, Brazil
Joachim Denzler, Friedrich Schiller University of Jena, Germany
Thomas Deserno, Technische Universität Braunschweig, Germany
Michel Devy, LAAS-CNRS, France
Sotirios Diamantas, Tarleton State University, Texas A&M University System, United States
Yago Diez, Yamagata University, Japan
Jana Dittmann, Otto-von-Guericke-Universität Magdeburg, Germany
Anastasios Drosou, Centre for Research & Technology, Hellas, Greece
Mahmoud El-Sakka, The University of Western Ontario, Canada
Grigori Evreinov, University of Tampere, Finland
Shu-Kai Fan, National Taipei University of Technology, Taiwan, Republic of China
Giovanni Maria Farinella, Università di Catania, Italy
Jean-Baptiste Fasquel, University of Angers, France
Aaron Fenster, Robarts Research Institute, Canada
Gernot Fink, TU Dortmund, Germany
David Fofi, Université de Bourgogne, France
Tyler Folsom, University of Washington, Bothell, United States
Gian Foresti, Unversity of Udine, Italy
Mohamed Fouad, Military Technical College, Egypt
Antonios Gasteratos, Democritus University of Thrace, Greece
Claudio Gennaro, CNR, Italy
Herman Gomes, Universidade Federal de Campina Grande, Brazil
Juan A. Gómez-Pulido, University of Extremadura, Spain
Amr Goneid, The American University in Cairo, Egypt
Manuel González-Hidalgo, Balearic Islands University, Spain
Bernard Gosselin, University of Mons, Faculty of Engineering, Belgium
Nikos Grammalidis, Centre of Research and Technology Hellas, Greece
Costantino Grana, Università degli Studi di Modena e Reggio Emilia, Italy
Christos Grecos, Central Washington University, United States
Benjamin Guthier, Universität Mannheim, Germany
Hsi-Chin Hsin, National United University, Taiwan, Republic of China
Hui-Yu Huang, National Formosa University, Taiwan, Republic of China
Céline Hudelot, Ecole Centrale de Paris, France
Chih-Cheng Hung, Kennesaw State University, United States
David i, , Spain
Laura Igual, Universitat de Barcelona, Spain
Jiri Jan, University of Technology Brno, Czech Republic
Tatiana Jaworska, Polish Academy of Sciences, Poland
Xiuping Jia, University of New South Wales, Australia
Xiaoyi Jiang, University of Münster, Germany
Luis Jiménez Linares, University of de Castilla-La Mancha, Spain
Zhong Jin, Nanjing University of Science and Technology, China
Leo Joskowicz, The Hebrew University of Jerusalem, Israel
Joni-Kristian Kamarainen, Tampere University of Technology, Finland
Martin Kampel, Vienna University of Technology, Austria
Mohan Kankanhalli, National University of Singapore, Singapore
Sehwan Kim, WorldViz LLC, United States
Nahum Kiryati, Tel Aviv University, Israel
Syoji Kobashi, University of Hyogo, Japan
Seong Kong, Sejong University, Korea, Republic of
Mario Köppen, Kyushu Institute of Technology, Japan
Andreas Koschan, University of Tennessee, United States
Dimitrios Kosmopoulos, University of Patras, Greece
Constantine Kotropoulos, Aristotle University of Thessaloniki, Greece
Jorma Laaksonen, Aalto University School of Science, Finland
Agata Lapedriza, , Spain
Slimane Larabi, U.S.T.H.B. University, Algeria
Mónica Larese, CIFASIS-CONICET, National University of Rosario, Argentina
Denis Laurendeau, Laval University, Canada
Sébastien Lefèvre, Université Bretagne Sud, France
Daw-Tung Lin, National Taipei University, Taiwan, Republic of China
Huei-Yung Lin, National Chung Cheng University, Taiwan, Republic of China
Giosue Lo Bosco, Università di Palermo, Italy
Nicolas Loménie, Université Paris Descartes, France
Angeles López, Universitat Jaume I, Spain
Ilias Maglogiannis, University of Piraeus, Greece
Baptiste Magnier, LGI2P de l'Ecole des Mines d’ALES, France
András Majdik, MTA SZTAKI, Hungary
Lucio Marcenaro, University of Genoa, Italy
Emmanuel Marilly, NOKIA - Bell Labs France, France
Jean Martinet, University Cote d'Azur / CNRS, France
José Martínez Sotoca, Universitat Jaume I, Spain
Iacopo Masi, University of Southern California, United States
Mitsuharu Matsumoto, The University of Electro-Communications, Japan
Javier Melenchón, Universitat Oberta de Catalunya, Spain
Jaime Melendez, Universitat Rovira i Virgili, Spain
Jean Meunier, Université de Montréal, Canada
Cyrille Migniot, Université de Bourgogne - le2i, France
Max Mignotte, Universite De Montreal, Canada
Dan Mikami, NTT, Japan
Steven Mills, University of Otago, New Zealand
Pradit Mittrapiyanuruk, Autodesk, Singapore
Birgit Moeller, Martin Luther University Halle-Wittenberg, Germany
Thomas B. Moeslund, Aalborg University, Denmark
Bartolomeo Montrucchio, Politecnico di Torino, Italy
Davide Moroni, Institute of Information Science & Technologies (ISTI)-CNR, Italy
Kostantinos Moustakas, University of Patras, Greece
Arrate Muñoz Barrutia, Universidad Carlos III de Madrid, Spain
Lazaros Nalpantidis, Aalborg University, Denmark
Nikolaos Nikolaidis, Aristotle University of Thessaloniki, Greece
Mikael Nilsson, Lund University, Sweden
Takahiro Okabe, Kyushu Institute of Technology, Japan
Yoshihiro Okada, Kyushu University, Japan
Gonzalo Pajares, Universidad Complutense de Madrid, Spain
Hong Pan, University of Copenhagen, Denmark
M. Pattichis, University of New Mexico, United States
Francisco José Perales, UIB, Spain
Felipe Pinage, Federal University of Parana, Brazil
Rainer Planinc, Vienna University of Technology, Austria
Stephen Pollard, HP Labs, United Kingdom
Stefan Posch, Martin-Luther-University Halle-Wittenberg, Germany
Giovanni Puglisi, University of Cagliari, Italy
Bogdan Raducanu, Computer Vision Center, Spain
Giuliana Ramella, CNR - Istituto per le Applicazioni del Calcolo "M. Picone", Italy
Huamin Ren, Inmeta Consulting AS, Norway
Alfredo Restrepo, Pontificia Universidad Javeriana, Colombia
Phill Rhee, Inha University, Korea, Republic of
Alessandro Rizzi, , Italy
Erik Rodner, Friedrich Schiller University Jena, Germany
Marcos Rodrigues, Sheffield Hallam University, United Kingdom
Ramón Ruiz, Universidad Politécnica de Cartagena, Spain
Silvio Sabatini, University of Genoa, Italy
Joaquin Salas, CICATA - Inst. Politecnico Nacional, Mexico
Ovidio Salvetti, National Research Council of Italy - CNR, Italy
Andreja Samcovic, University of Belgrade, Serbia
Javier Sánchez, University of Las Palmas De Gran Canaria, Spain
K. C. Santosh, The University of South Dakota, United States
Jun Sato, Nagoya Institute of Technology, Japan
Gerald Schaefer, Loughborough University, United Kingdom
Mário Secca, CEFITEC, Departamento de Fisica, FCT/UNL, Portugal
Fiorella Sgallari, University of Bologna, Italy
Shishir Shah, University of Houston, United States
Xiaowei Shao, University of Tokyo, Japan
Maryam Shokri, , United States
Luciano Silva, Universidade Federal do Parana, Brazil
Bogdan Smolka, Silesian University of Technology, Poland
Ferdous Sohel, Murdoch University, Australia
Ömer Soysal, Southeastern Louisiana University, United States
Filippo Stanco, Università di Catania, Italy
Tania Stathaki, Imperial College London, United Kingdom
William Stoecker, Stoecker & Associates / Missouri University of Science and Technology, United States
Mu-Chun Su, National Central University, Taiwan, Republic of China
Yajie Sun, Samsung Research America, United States
David Svoboda, Masaryk University, Czech Republic
Tamás Szirányi, MTA SZTAKI, Hungary
Ryszard Tadeusiewicz, Agh University Science Technology, Poland
Norio Tagawa, Tokyo Metropolitan University, Japan
Hiroki Takahashi, The University of Electro-Communications, Tokyo, Japan
Tolga Tasdizen, University of Utah, United States
João Tavares, FEUP - Faculdade de Engenharia da Universidade do Porto, Portugal
Domenico Tegolo, Università degli Studi di Palermo, Italy
Sheshadri Thiruvenkadam, , India
YingLi Tian, The City College of New York, United States
Yubing Tong, Medical Image Processing Group, at University of Pennsylvania, United States
Andrea Torsello, Università Ca' Foscari di Venezia, Italy
Alain Tremeau, Université Jean Monnet in Saint Etienne, France
Du-Ming Tsai, Yuan-Ze University, Taiwan, Republic of China
Cesare Valenti, Università degli Studi di Palermo, Italy
Joost van de Weijer, Autonomous University of Barcelona, Spain
João Vilaça, DIGARC, Polytechnic Institute of Cavado and Ave, Portugal
Muriel Visani, , France
Salvatore Vitabile, University of Palermo, Italy
Vassilios Vonikakis, Advanced Digital Sciences Center (ADSC), Singapore
Frank Wallhoff, Jade University of Applied Science, Germany
Tao Wang, BAE Systems, United States
Wen-June Wang, National Central University, Taiwan, Republic of China
Toyohide Watanabe, Nagoya Industrial Science Research Institute, Japan
Quan Wen, University of Electronic Science and Technology of China, China
Andrew Willis, University of North Carolina at Charlotte, United States
Christian Wöhler, TU Dortmund University, Germany
Stefan Wörz, University of Heidelberg, Germany
Pingkun Yan, Rensselaer Polytechnic Institute, United States
Guoan Yang, Xian Jiaotong University, China
Lara Younes, AriadNext, France
Shan Yu, , United States
Hongfeng Yu, University of Nebraska - Lincoln, United States
Yizhou Yu, University of Illinois, United States
Qieshi Zhang, Waseda University, Japan
Jianmin Zheng, Nanyang Technological University, Singapore
Huiyu Zhou, Queen's University Belfast, United Kingdom
Zhigang Zhu, City College of New York, United States
Yun Zhu, UCSD, United States
Peter Zolliker, Empa, Swiss Federal Laboratories for Materials Science and Technology, Switzerland
Ju Zou, University of Western Sydney, Australia
Tatjana Zrimec, Univeristy of Primorska, Slovenia

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